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Directed Electroless Deposition of Metals on Thiol Modified Au Using Microcontact Printing

Christopher Zangmeister and Roger van Zee*

Process Measurements Division, Chemical Science and Technology Laboratory, National Institute of Standards and Technology,
Gaithersburg, MD 20899 USA

This is an abstract for a presentation given at the
10th Foresight Conference on Molecular Nanotechnology

 

Directed deposition of metals on surfaces is being investigated for potential use in the formation of a covalently bonded top contact for molecular electronic applications. Such contacts may be formed by the coordination of metals in solution utilizing traditional electroless plating. This study focuses on the modification of model molecular electronic species to direct the deposition of Cu. This result is obtained by thiol modified Au substrates and microcontact printing (µCP) of the desired molecules. 4-mercaptobenzoic acid (4-MBA), a model for molecular electronic compounds, was used to direct the deposition of Cu. After patterning, copper is preferentially deposited on the 4-MBA modified region of the surface. These patterned surfaces are studied using Fourier transform infrared spectroscopy (FTIR), and optical, atomic force, and scanning electron microscopies.

Abstract in Microsoft Word® format 20,294 bytes


*Corresponding Address:
Roger van Zee
Process Measurements Division, Chemical Science and Technology Laboratory, National Institute of Standards and Technology
100 Bureau Drive, Gaithersburg, MD 20899 USA
Phone: 301-975-8709 Fax: 301-975-8288
Email: Roger.vanZee@nist.gov



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